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Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

DOW Epoxy Resin

The DOW advanced epoxy resin series is engineered for high-performance applications requiring robust thermal stability and chemical resistance. Derived from phenolic novolac backbones, each resin undergoes epoxidation to yield multiple reactive groups per molecule, enabling dense crosslinking during curing.

The molecular architecture—featuring aromatic rings interconnected by methylene bridges—provides inherent rigidity, while tailored viscosity ranges (from low to ultra-low) ensure compatibility with coatings, composites, and precision electronic encapsulation.

Post-cure, these resins form tightly crosslinked networks that excel in demanding environments, such as aerospace components exposed to extreme temperatures or industrial coatings requiring abrasion resistance.


  • dow-epoxy-resin
  • dow-epoxy-resin

Features Of DOW Epoxy Resin 

  1. Structural Design: Phenolic resin backbone with multiple epoxy functional groups (~2.8 per molecule), enabling a dense crosslinked structure for enhanced thermal stability and chemical resistance compared to bisphenol A-based epoxies

  2. Low Viscosity: Excellent flowability at room temperature, eliminating solvent needs—ideal for impregnation, coating, and other viscosity-sensitive processes

  3. Curing Performance: Forms a high-strength 3D network with amine-based hardeners, achieving long-term service temperatures exceeding 150°C

  4. Chemical Resistance: Superior resistance to acids, alkalis, salts, and organic solvents, suitable for harsh environments

  5. Adhesion & Durability: Strong bonding to metals, glass, and composites, ensuring structural reliability in demanding applications

Typical Applications Of DOW Epoxy Resin 

  1. Industrial Coatings: Anti-corrosion protection for tanks, pipelines, and marine equipment

  2. Composites: Reinforcement in fiber winding (e.g., pipes, pressure vessels) and structural laminates

  3. Adhesives: High-strength bonding for metals, glass, and abrasive materials

  4. Electrical Insulation: Varnishes and potting materials for high-temperature electronic components

Specifications Of DOW Epoxy Resin 

ModelEpoxy Equivalent Weight (g/eq)Viscosity at 25°C (mPa·s)Hydrolyzable Chloride (%)Total Chloride (%)
DER736330–36050–100≤0.1≤0.3
DER732310–33030–60≤0.1≤0.3
DER431175–190/≤0.15≤0.3
DER383176–1839000–10500≤0.1≤0.3
DER354176–1823500–4500≤0.1≤0.3
DER353172–1762500–3500≤0.1≤0.3
DER332176–1823500–4500≤0.1≤0.3
DER331175–190/≤0.15≤0.3


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