Two-component, room-temperature curing epoxy system with excellent pot life and controlled working time.
High bond strength to metals, composites, ceramics, and engineered plastics—even on lightly prepared surfaces.
Outstanding resistance to thermal cycling, humidity, and common industrial chemicals including oils and solvents.
Low shrinkage and minimal exotherm during cure, ensuring dimensional stability in precision assemblies.
RoHS-compliant formulation with no added heavy metals or halogenated flame retardants.
Aerospace component bonding, including sensor mounting and composite-to-metal structural joints.
Electronics encapsulation and die-attach for power modules and high-reliability PCB assemblies.
Automotive powertrain applications such as engine control unit (ECU) housing sealing and sensor fixation.
Industrial equipment repair, including wear-resistant rebuilding of pump housings and gearboxes.
Medical device assembly requiring biocompatibility-certified adhesives for non-invasive diagnostic instruments.
| Chemical Type | Bisphenol-A based epoxy resin system with modified amine hardener |
| Product Form | Two-part liquid: Part A (resin), Part B (hardener); supplied in pre-weighed kits |
| Appearance | Part A: Pale amber transparent liquid; Part B: Light tan viscous liquid |
| Mix Ratio (by weight) | 100 : 35 (A : B) |
| Pot Life at 25°C | 60–75 minutes after mixing |
| Full Cure Time | 72 hours at 25°C or 4 hours at 80°C |
| Primary Applications | Structural bonding, encapsulation, and sealing in demanding industrial environments |
| Key Features | Room-temperature cure, low exotherm, high peel strength, chemical resistance |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China