High reactivity with epoxy resins, enabling rapid cure at ambient or elevated temperatures.
Excellent flexibility and toughness in cured epoxy systems, improving impact resistance.
Low viscosity facilitates easy handling, mixing, and processing in industrial formulations.
Good compatibility with standard epoxy resins and common reactive diluents.
Provides balanced thermal stability and chemical resistance in final cured networks.
Structural adhesives for aerospace and automotive bonding.
Electrical encapsulants and potting compounds for PCB protection.
Coating systems for corrosion-resistant industrial maintenance.
Flooring and grouting materials requiring fast turnaround in commercial facilities.
Composite matrix resins for pultrusion and filament winding processes.
| Chemical Type | Aliphatic polyamine |
| Product Form | Liquid |
| Appearance | Clear to pale yellow liquid |
| Amine Value (mg KOH/g) | 490–510 |
| Viscosity at 25°C (cP) | 150–250 |
| Primary Applications | Epoxy resin curing agent for adhesives, coatings, composites, and encapsulants |
| Key Features | Fast-curing, low-viscosity, flexible network formation |
| Benefits | Improved processability, enhanced toughness, reduced energy consumption during cure |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China