Name: Dow DOWSIL 7920 Die Attach Adhesive
Brand: Guangzhou Eric Wei Chemical Co., Ltd.

Features Of Dow DOWSIL 7920 Die Attach Adhesive

High thermal conductivity for efficient heat dissipation in power electronics.
Low modulus silicone formulation enabling stress relief and improved reliability under thermal cycling.
Room-temperature dispensing with controlled cure profile—tack-free in minutes, full cure at elevated temperature.
Excellent adhesion to common die and substrate materials including copper, aluminum, ceramic, and silicon.
Halogen-free and RoHS-compliant formulation supporting environmentally responsible manufacturing.

Typical Applications Of Dow DOWSIL 7920 Die Attach Adhesive

Power modules for electric vehicles (EVs) and hybrid electric vehicles (HEVs).
IGBT and MOSFET die attachment in industrial inverters and motor drives.
LED packaging requiring high thermal management and long-term stability.
RF and microwave semiconductor assemblies in telecommunications infrastructure.
High-reliability aerospace and defense electronics where thermal cycling resistance is critical.

Chemical Type	Platinum-cured addition-cure silicone
Product Form	Paste (thixotropic, non-sag)
Appearance	Off-white to light gray, homogeneous paste
Primary Applications	Non-structural die attach for discrete semiconductors and power modules
Key Features	Thermally conductive, low modulus, halogen-free, room-temperature dispensable
Benefits	Reduces interfacial thermal resistance, mitigates die cracking, enables high-yield automated dispensing
Cure Mechanism	Heat-activated platinum-catalyzed addition reaction (typical cure: 150°C for 60 min)
Storage Conditions	Refrigerated at 2–8°C; stable for 12 months unopened

Get in Touch with ERICW

Let competitive chemical materials go global.

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Contact With Us:

E-mail: wangxingqiang@ericwchem.com
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Have a Questions? Call Us:

15921782326
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China