High electrical conductivity achieved via silver-filled silicone formulation.
Excellent thermal stability with continuous service temperature up to 200 °C.
Low modulus and high flexibility for stress relief in dynamic or thermally cycled assemblies.
Room-temperature cure with optional heat acceleration for improved throughput.
Good adhesion to diverse substrates including metals, ceramics, and engineered plastics.
EMI/RFI shielding gasket bonding in telecommunications enclosures.
Grounding of flexible printed circuits (FPCs) and rigid-flex assemblies.
Electrical interconnects in LED lighting modules and power electronics housings.
Bonding of sensors and actuators requiring both mechanical attachment and signal continuity.
| Chemical Type | Silver-filled addition-cure silicone |
| Product Form | Paste, dual-component (Part A + Part B) |
| Appearance | Gray, homogeneous paste |
| Primary Applications | EMI shielding, grounding, and low-resistance electrical interconnects |
| Key Features | Electrically conductive, thermally stable, flexible, low-stress bond |
| Benefits | Reduces assembly steps vs. mechanical fasteners; maintains conductivity under thermal cycling |
| Cure System | Platinum-catalyzed addition cure |
| Storage Conditions | 2–8 °C; protect from moisture and contamination |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China