Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL EC-6601 Electrically Conductive Adhesive

Dow DOWSIL EC-6601 is a silver-filled electrically conductive adhesive from Dow’s DOWSIL EC series, offering low-resistance bonding for EMI shielding, grounding, and flexible circuit assembly. It cures at room temperature or with mild heat, provides excellent adhesion to plastics and metals, and maintains conductivity under thermal cycling and humidity exposure.
  • dow dowsil ec 6601 electrically conductive adhesive_73291f8c
  • dow dowsil ec 6601 electrically conductive adhesive_73291f8c

Features Of Dow DOWSIL EC-6601 Electrically Conductive Adhesive

  1. High electrical conductivity achieved via silver-filled silicone formulation.

  2. Excellent thermal stability with continuous service temperature up to 200 °C.

  3. Low modulus and high flexibility for stress relief in dynamic or thermally cycled assemblies.

  4. Room-temperature cure with optional heat acceleration for improved throughput.

  5. Good adhesion to diverse substrates including metals, ceramics, and engineered plastics.

Typical Applications Of Dow DOWSIL EC-6601 Electrically Conductive Adhesive

  1. EMI/RFI shielding gasket bonding in telecommunications enclosures.

  2. Grounding of flexible printed circuits (FPCs) and rigid-flex assemblies.

  3. Electrical interconnects in LED lighting modules and power electronics housings.

  4. Bonding of sensors and actuators requiring both mechanical attachment and signal continuity.

Specifications Of Dow DOWSIL EC-6601 Electrically Conductive Adhesive

Chemical TypeSilver-filled addition-cure silicone
Product FormPaste, dual-component (Part A + Part B)
AppearanceGray, homogeneous paste
Primary ApplicationsEMI shielding, grounding, and low-resistance electrical interconnects
Key FeaturesElectrically conductive, thermally stable, flexible, low-stress bond
BenefitsReduces assembly steps vs. mechanical fasteners; maintains conductivity under thermal cycling
Cure SystemPlatinum-catalyzed addition cure
Storage Conditions2–8 °C; protect from moisture and contamination


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