Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL Instantglaze III Assembly Adhesive

Dow DOWSIL Instantglaze III Assembly Adhesive is a fast-curing, silicone-based adhesive designed for precision bonding of glass, metal, and plastics in architectural and transportation glazing. It offers excellent UV resistance, thermal stability, and low modulus flexibility. Trusted for rapid assembly, high clarity, and reliable long-term performance without primers.
  • dow dowsil instantglaze iii assembly adhesive_e3da9239
  • dow dowsil instantglaze iii assembly adhesive_e3da9239

Features Of Dow DOWSIL Instantglaze III Assembly Adhesive

  1. Ultra-fast tack development — achieves handling strength in under 60 seconds on common substrates.

  2. Room-temperature cure with excellent long-term durability and resistance to thermal cycling (-40 °C to +150 °C).

  3. Low-VOC, solvent-free silicone formulation compliant with global environmental and workplace safety standards.

  4. Optimized for bonding glass, anodized aluminum, stainless steel, and engineered plastics without primers.

  5. Non-corrosive to sensitive electronics and optical components; passes ASTM D3359 adhesion testing.

Typical Applications Of Dow DOWSIL Instantglaze III Assembly Adhesive

  1. Automotive lighting assemblies — headlamp and taillamp lens-to-housing bonding.

  2. Architectural glazing systems — structural and perimeter bonding of insulating glass units (IGUs).

  3. Consumer electronics enclosures — seamless bonding of glass covers and metal frames.

  4. Medical device housings — assembly of sterilizable, biocompatibility-compatible enclosures.

  5. Industrial control panels — durable, vibration-resistant bonding of display overlays and bezels.

Specifications Of Dow DOWSIL Instantglaze III Assembly Adhesive

Chemical TypeAcetoxy-cure silicone elastomer
Product FormThixotropic paste, single-component
AppearanceTranslucent off-white to light beige
Primary ApplicationsStructural glazing, optical assembly, electronic enclosure bonding
Key FeaturesFast tack, primerless adhesion, low shrinkage, non-corrosive
BenefitsReduced assembly time, improved line efficiency, enhanced reliability under thermal stress
Shelf Life (unopened)12 months at 25 °C in original sealed packaging
Cure MechanismMoisture-cured at ambient conditions


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