Name: Dow DOWSIL TC-5022 Thermally Conductive Compound
Brand: Guangzhou Eric Wei Chemical Co., Ltd.

Features Of Dow DOWSIL TC-5022 Thermally Conductive Compound

High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low thermal resistance with excellent interfacial wetting, minimizing air gaps between heat-generating components and heatsinks.
Non-silicone-oil bleeding formulation ensures long-term stability and prevents contamination of sensitive optical or electrical surfaces.
Thixotropic paste consistency enables precise dispensing and maintains positional stability during reflow or curing processes.
RoHS-compliant and halogen-free, supporting environmental compliance and reliability in regulated electronics manufacturing.

Typical Applications Of Dow DOWSIL TC-5022 Thermally Conductive Compound

Thermal interface material (TIM) for power modules and IGBTs in electric vehicle inverters and onboard chargers.
Heat transfer medium between LED packages and metal-core printed circuit boards (MCPCBs) in high-brightness lighting systems.
Die-attach and heat-spreading solution for semiconductor packages in 5G base station power amplifiers.
Thermal management interface in industrial motor drives and renewable energy inverters.

Chemical Type	Silicone-based thermally conductive paste
Product Form	Paste (thixotropic)
Appearance	Gray, uniform paste
Thermal Conductivity	1.5 W/m·K (ASTM D5470)
Specific Gravity	2.8 g/cm³ (ASTM D1475)
Operating Temperature Range	−40 °C to +150 °C (continuous)
Dielectric Strength	≥15 kV/mm (ASTM D149)
RoHS Compliance	Compliant (2015/863/EU)

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E-mail: wangxingqiang@ericwchem.com
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