Name: DOWSIL Q1-9226 Thermally Conductive Silicone Adhesive
Brand: Guangzhou Eric Wei Chemical Co., Ltd.

Features Of DOWSIL Q1-9226 Thermally Conductive Silicone Adhesive

High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.
Room-temperature vulcanizing (RTV) cure with moisture-cure mechanism—no mixing or refrigeration required.
UL 94 V-0 rated for flame retardancy, supporting safety compliance in power electronics and lighting.
Excellent adhesion to common substrates including aluminum, copper, FR-4, and polycarbonate without primers.

Typical Applications Of DOWSIL Q1-9226 Thermally Conductive Silicone Adhesive

Thermal interface bonding of LED modules to metal-core printed circuit boards (MCPCBs).
Attachment of power semiconductor devices (IGBTs, MOSFETs, diodes) to heat sinks in inverters and converters.
Encapsulation and potting of high-power drivers and automotive control units requiring thermal management.
Structural thermal bonding in outdoor lighting fixtures exposed to wide temperature and humidity ranges.

Chemical Type	Condensation-cure, thermally conductive silicone elastomer
Product Form	Paste (non-sag, thixotropic)
Appearance	Gray, uniform paste
Primary Applications	Thermal interface material (TIM), structural adhesive, and conformal bond layer
Key Features	RTV cure, low modulus, UL 94 V-0, halogen-free
Benefits	Reduces thermal resistance, accommodates CTE mismatch, enables automated dispensing
Shelf Life (unopened, 25°C)	12 months
Cure Time (surface dry, 23°C/50% RH)	Approx. 30 minutes

Get in Touch with ERICW

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Contact With Us:

E-mail: wangxingqiang@ericwchem.com
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15921782326
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China